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SEPTIC SYSTEM INVENTOR Y <br /> Address: 1535 Long Lake Blvd. PID: 26-118-23 33 0014 <br /> Building Type residence #BRs/GPD: 3 #Systems 1 Units Billed 1 <br /> Permit#: 3304 Date of Permit: 9/15/72 Installer: LeVahn Bros. Inc. <br /> System Type standard trench Experimental: no Appliances <br /> SYSTEM CONDITION � <br /> Conformity: 3 Tank Condition: 9 DF condition: 14 Failure Pot: medium <br /> SEPTIC TANKS <br /> Material: concrete block Capacity: 1000, 750 <br /> Setback to Bldg: Cesspool: unknown <br /> DRAINFIELD <br /> Length of Lines # Lines: Trench Width: <br /> Treatment Area: Type of Filter Soil Borin es <br /> g� Y <br /> Tile Size: Under Tile Perc Rate: <br /> Setback DF-Bldg: DF Ht above Wt: 0 <br /> Soil Type: Limitations: water table <br /> WELL DATA <br /> Setbacks - Well-Tanks: 50 Well-DF: 50 Report in File no <br /> Pump Type: subm. Depth: Diameter: 4 Method: drilled <br /> INSPECTIONRECORD PUMPDUT RECORD <br /> DATE DESCRIPTION COMPLIANCE DATE GALLONS <br /> 11/19/82 no surfacing 1 5/15/89 1500 <br /> 7/21/86 no surfacing-tanks located 1 5/6/91 800 <br /> 6/24/88 no surfacing 1 4/26/95 1500 <br /> 6/21/90 no surfacing 1 5/7/97 1500 <br /> 10/6/92 no surfacing-need riser,l st tank 1 <br /> 6/27/94 non-conforming-repair by 12/31/96 3 <br /> 8/28/98 connect to sewer by 12/31/98 3 � <br /> � ' <br /> � � � <br /> # i <br /> j <br /> � � � � � ,�� � <br /> i � <br /> � . <br /> ' . � � . . . . _ . � . i' . . �. , . . <br /> . � � . .. � . . I . . - . <br /> .. I . . . .. � . � ����i . „ � ' <br /> ' � . . . . . � _.. i .. � . . " . ' . �. .., <br /> . . � . � � .. . . � . ' . ' . � . . <br /> � . . . " . . . . .. . � .. . . <br /> } . ... . . .. . : � � . � . � .. .: <br /> - r . . . . . . . � .. ,. � . � . . .� .. <br /> . .[ � . . � . ... � - ' � . . . .. � . . <br /> . i , . . . - . . . i� . � . ._ . . <br /> �i� . . . - . . . . . . � '- .... <br />� . � � .. � . .... . . _ . . . ''' .: ,.3, ., . . . .� . <br /> 4 . � . . � - . , � � . <br /> . . i . . . . . . .. . <br /> . � . � . . . . � . . ,. . . ��� . . � � � . . <br />