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1:-39 <br />T " yriou 'ri.,S'1 DATA SIIGi:I <br />Test hole locatio L r::, -fid% 7+,N4 ole number—r—_ <br />Date test hile was prepared,IL_9'40 Depth of )tole bottom, <br />Diameter of hole, incites. <br />Soil data from test hole: <br />Depth, inches Soil texture <br />Method of scratching sidewall- <br />Depth of pea-sized gravel in butCom of Bole, irtchus. ^— <br />Date and hour of initial water filling-4��-- ,�0� <br />Depth of initial water filling, f OR inches above hole bOL'L'oln. <br />Method used to Maintain at 1ca:;C 12 inches of wafer depth in hole for at lc::::t <br />4 hours <br />Percolation test readings made by <br />s-7-2/) _ starting at _�2, a. Ill. <br />date-) J ;!;.• <br />�.. during test, inches. <br />u:t <br />Maximum tater depth above hula b,JrL, <br />Time <br />Tive Interval, <br />Minutes <br />Measurement, <br />inches <br />Drop in water <br />level, inches <br />Percolation <br />rate, <br />minutes per <br />inch <br />Remarks <br />, 3 <br />X2.3 o <br />L <br />._ <br />Percolation rate _ J tninutaa por inch. <br />